1. Sustainable management
  2. Quality Assurance
  3. Quality assurance equipment

Quality assurance equipment

Heesung Metals is equipped with the following to ensure quality of its products.

Working towards better quality services.

Heesung Metals uses various equipment including EPMA, ICP-MASS, SEM, contact realibility testers, vacuum dissolution tanks, high temperature tanks and high pressure high temperature reactors.

Applicable areas
Observation and analysis of structure in small areas
Features
  • PROGRAM
  • - Automated high speed qualitative analysis
  • - Quantitative Analysis
  • - Line Analysis
  • - MAPPING Area Analysis
  • - State Analysis
  • Elements that can be analyzed : 5B ~ 92UU
  • Image magnification : X50 ~ X400,000
APPLICATION
  • Electronic/ semiconductor material analysis
  • Identification of causes of defects
  • Foreign substance analysis on the surface of Contact/Solder/lead materials
  • Ingredient analysis of contact/Solder/lead materials
  • Verification of segregation in alloys, ingredient distribution
  • Qualitative and quantitative analysis of other ingredients
Applicable areas
Observation of fine structures and surface of organic and inorganic materials
Features
  • Acceleration voltage: 1 ~ 25 kv
  • Maginification : X35 ~ X200,000
APPLICATION
  • GBW surface observation
  • Observation of metal particles
  • Nano Powder development
  • Surface observation of electric, electronic and communication materials

Applicable areas
  • Purity analysis of precious metals
  • Analysis of minute amounts of ingredients
Features
  • Wavelength range : 167 nm~785 nm
  • Simultaneous analysis
  • Vertical touch method
APPLICATION
  • GBW ,Pt, ITO ingredient analysis
  • Purity management for precious metals
  • Purity analysis of contacts, lead materials, plating materials
Applicable areas
Measurement of changes in characteristics of organic and inorganic compounds due to heat
Features
  • Temperature range : Ambient to 1500 ˚C
  • Measurement type : TG, DTA, DSC
APPLICATION
  • Electronic/ semiconductor material analysis
  • Identification of causes for defects
  • Foreign substance analysis for contact/ lead materials
  • Ingredient analysis for contact/ lead materials
  • Segregation analysis of alloys, ingredient distribution analysis
  • Qualitative and quantitative analysis of ingredients used in minute amounts

Applicable areas
  • Relay life test after developing contact materials
Features
  • Welding test for contacts
  • Opening test for contacts
  • Voltage drop test
APPLICATION
  • Contact material characteristics test
  • Solid/Clad contact characteristics test
Applicable areas
Measurement of electric current through a comparison and adjustment of the standard thermocouple and thermocouple to be adjusted
Features
  • Range : 400℃ ~ 1250℃
  • BSC : ± 1.2 ℃ ( K=2 )
APPLICATION
  • Comparison and adjustment of precious metal thermocouple

Applicable areas
  • Solid samples that need to be liquefied are undergone microwave treatment at high pressure, high temperatures.
  • Time needed for sample analysis shortened
  • Analysis of difficult samples
  • Zero generation of harmful gas
Features
  • Pressure : Max 1500 psi
  • Temperature : Max 300℃
  • Number of Rotors : 10 (Amount of samples that can be analyzed per session)
APPLICATION
  • Pre-processing of ICP-MS, ICP-AES, AAS, IC analysis samples
  • Analysis of difficult to analyze samples
Applicable areas
Analysis of oxygen content in inorganic substances
Features
  • Range: 0.000005 %~ 5.0 %
APPLICATION
  • Management of oxygen content in lead materials
  • Oxidization level management of metal powders
  • Oxygen content analysis for electric, electronic materials

Applicable areas
  • Surface appearance. Wire surface. Three dimensional appearance observation, qualitative analysis
APPLICATION
  • Analysis of foreign substance on the surface of contact, platinum products, MGT, GBW . SEM imaging
    Qualitative analysis of ingredients used in minute amounts, semi-quantitative analysis, ingredient distribution analysis through mapping
Applicable areas
Minute amounts of ingredients in GBW is quantitatively and qualitatively analyzed for metal elements using the waves generated through sparks
Features
  • Range : 121 nm ~ 589 nm
  • Simultaneous analysis of numerous elements
APPLICATION
  • Analysis of foreign substances in GBW

Applicable areas
Observation of second or third sources, measurement of size, Image analyzer
Applicable areas
Power density distribution measurement
Features
  • Range : 0.02 ㎛~ 2000 ㎛
APPLICATION
  • Ag powder density distribution measurement

Applicable areas
Measurement of surface area of porous substances
Features
  • Range : Min 0.01 m2/g
APPLICATION
  • Ag powder density distribution measurement
Applicable areas
Qualitative and quantitative analysis of components of substances
Features
  • Consecutive analysis device for fluorescent X rays
  • Analysis elements : 4Be ~ 92U
  • X-ray generator : 4kW (60kV, 150mA)
APPLICATION
  • Analysis of platinum rhodium alloy composition ration, ratio of indium and tin in ITO, quantitative analysis of additives in contact and lead material samples

Applicable areas
Thin films are deposed using ITO Target to measure the transmittance rate, surface resistance and thickness of film.
Applicable areas
Qualitative and quantitative analysis of metal alloy samples
Features
  • Spectral Range :165 nm ~ 460 nm
APPLICATION
  • Foreign substance management in contact, lead materials

Applicable areas
Measurement of the specific gravity of liquid samples
Features
  • Range : (0~ 3) g/cm3
APPLICATION
  • EEJA plating solution ,PGC, measurement of specific gravity of samples
Applicable areas
Negative ion analysis of plating solutions, halogen analysis
Features
  • Resolution: 0.00238 nS/cm
APPLICATION
  • Analysis of SO3 2-, SO4 2- ,Cl- in Au plating solutions

Applicable areas
Quantitative analysis of foreign substances and carbon on BW surface
Features
  • Range : 0.03 ppb~ 50 ppm
APPLICATION
  • Analysis of total organic carbon in BW
Applicable areas
Analysis of main ingredients and additives in soldered silver, contact materials
Features
  • Resolution 0.0001 mL
APPLICATION
  • Analysis of Ag, Cu content in soldered silver and contact materials